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Interfacial reaction of gas-atomized Sn–Zn solder containing Ni and Cu additives
S. Yagi, T. Ichitsubo, E. Matsubara, M. Yamaguchi, H. Kimura, K. SasamoriVolume:
484
Year:
2009
Language:
english
DOI:
10.1016/j.jallcom.2009.05.088
File:
PDF, 1.39 MB
english, 2009