Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallization
Da-Quan Yu, Chengkuo Lee, Li Ling Yan, Meei Ling Thew, John H. LauVolume:
485
Year:
2009
Language:
english
DOI:
10.1016/j.jallcom.2009.05.136
File:
PDF, 1.37 MB
english, 2009