DO22–(Cu,Ni)3Sn intermetallic compound nanolayer formed in Cu/Sn-nanolayer/Ni structures
Lilin Liu, Haiyou Huang, Ran Fu, Deming Liu, Tong-Yi ZhangVolume:
486
Year:
2009
Language:
english
DOI:
10.1016/j.jallcom.2009.07.054
File:
PDF, 1.16 MB
english, 2009