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DO22–(Cu,Ni)3Sn intermetallic compound nanolayer formed in...

DO22–(Cu,Ni)3Sn intermetallic compound nanolayer formed in Cu/Sn-nanolayer/Ni structures

Lilin Liu, Haiyou Huang, Ran Fu, Deming Liu, Tong-Yi Zhang
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Volume:
486
Year:
2009
Language:
english
DOI:
10.1016/j.jallcom.2009.07.054
File:
PDF, 1.16 MB
english, 2009
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