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Investigation of small Sn–3.5Ag–0.5Cu additions on the microstructure and properties of Sn–8Zn–3Bi solder on Au/Ni/Cu pads
Asit Kumar Gain, Tama Fouzder, Y.C. Chan, Ahmed Sharif, Winco K.C. YungVolume:
489
Year:
2010
Language:
english
DOI:
10.1016/j.jallcom.2009.09.150
File:
PDF, 1.80 MB
english, 2010