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The adsorption of Ag3Sn nano-particles on Cu–Sn intermetallic compounds of Sn–3Ag–0.5Cu/Cu during soldering
Xiaoying Liu, Mingliang Huang, Yanhui Zhao, C.M.L. Wu, Lai WangVolume:
492
Year:
2010
Language:
english
DOI:
10.1016/j.jallcom.2009.11.131
File:
PDF, 1.56 MB
english, 2010