![](/img/cover-not-exists.png)
Influence of thermal aging on microhardness and microstructure of Sn–0.3Ag–0.7Cu–xIn lead-free solders
Kannachai Kanlayasiri, Tadashi ArigaVolume:
504
Year:
2010
Language:
english
DOI:
10.1016/j.jallcom.2010.05.057
File:
PDF, 1.64 MB
english, 2010