Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads
Tama Fouzder, Ismathullakhan Shafiq, Y.C. Chan, A. Sharif, Winco K.C. YungVolume:
509
Year:
2011
Language:
english
DOI:
10.1016/j.jallcom.2010.10.081
File:
PDF, 2.18 MB
english, 2011