Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering
L.C. TsaoVolume:
509
Year:
2011
Language:
english
DOI:
10.1016/j.jallcom.2010.11.010
File:
PDF, 1.96 MB
english, 2011