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Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1 wt% nano-ZrO2 composite solder on OSP-Cu pads
Asit Kumar Gain, Tama Fouzder, Y.C. Chan, Winco K.C. YungVolume:
509
Year:
2011
Language:
english
DOI:
10.1016/j.jallcom.2010.12.048
File:
PDF, 1.57 MB
english, 2011