Intermetallic compound growth suppression at high...

Journal of Alloys and Compounds 2012 Vol. 511; Iss. 1

Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates

H.R. Kotadia, O. Mokhtari, M.P. Clode, M.A. Green, S.H. Mannan
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Volume:
511
Year:
2012
Language:
english
DOI:
10.1016/j.jallcom.2011.09.024
File:
PDF, 6.57 MB
english, 2012
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