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Morphologies and grain orientations of Cu–Sn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints
Wei Liu, Yanhong Tian, Chunqing Wang, Xuelin Wang, Ruiyang LiuVolume:
86
Year:
2012
Language:
english
DOI:
10.1016/j.matlet.2012.07.016
File:
PDF, 1.06 MB
english, 2012