Effect of the combination of surface finishes and solder...

Microelectronic Engineering 2012 Vol. 98; Iss. none

Effect of the combination of surface finishes and solder balls on JEDEC drop reliability of chip-scale packages

Tong Hong Wang, Chung-Hung Tsai, Yi-Shao Lai
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Volume:
98
Year:
2012
Language:
english
DOI:
10.1016/j.mee.2012.05.001
File:
PDF, 925 KB
english, 2012
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