Drop impact reliability of Sn–1.0Ag–0.5Cu BGA interconnects...

Microelectronics Reliability 2012 Vol. 52; Iss. 7

Drop impact reliability of Sn–1.0Ag–0.5Cu BGA interconnects with different mounting methods

Bo Wang, Jiajun Li, Anthony Gallagher, James Wrezel, Pongpinit Towashirporn, Naiqin Zhao
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Volume:
52
Year:
2012
Language:
english
DOI:
10.1016/j.microrel.2012.02.001
File:
PDF, 1.51 MB
english, 2012
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