The performance and fracture mechanism of solder joints under mechanical reliability test
Wei-Luen Jang, Tai-Siang Wang, Yen-Fen Lai, Kwang-Lung Lin, Yi-Shao LaiVolume:
52
Year:
2012
Language:
english
DOI:
10.1016/j.microrel.2012.03.011
File:
PDF, 1.84 MB
english, 2012