The performance and fracture mechanism of solder joints...

The performance and fracture mechanism of solder joints under mechanical reliability test

Wei-Luen Jang, Tai-Siang Wang, Yen-Fen Lai, Kwang-Lung Lin, Yi-Shao Lai
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Volume:
52
Year:
2012
Language:
english
DOI:
10.1016/j.microrel.2012.03.011
File:
PDF, 1.84 MB
english, 2012
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