Microstructure, mechanical, and thermal properties of the...

Materials Science and Engineering: A 2012 Vol. 551; Iss. none

Microstructure, mechanical, and thermal properties of the Sn–1Ag–0.5Cu solder alloy bearing Fe for electronics applications

Dhafer Abdul-Ameer Shnawah, Suhana Binti Mohd Said, Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin, Fa Xing Che
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Volume:
551
Year:
2012
Language:
english
DOI:
10.1016/j.msea.2012.04.115
File:
PDF, 2.13 MB
english, 2012
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