Chemistry of Siloxane Amide as a New Curing Agent for Epoxy...

Macromolecular Chemistry and Physics 2005 Vol. 206; Iss. 24

Chemistry of Siloxane Amide as a New Curing Agent for Epoxy Resins: Material Characterization and Properties

Marimuthu Srividhya, Madurai Suguna Lakshmi, Boreddy Sivarami R. Reddy
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Volume:
206
Year:
2005
Language:
english
Pages:
11
DOI:
10.1002/macp.200500143
File:
PDF, 352 KB
english, 2005
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