The influence of copper nanopowders on microstructure and hardness of lead–tin solder
D Lin, G.X Wang, T.S Srivatsan, Meslet Al-Hajri, M PetraroliVolume:
53
Year:
2002
Language:
english
DOI:
10.1016/s0167-577x(01)00503-1
File:
PDF, 588 KB
english, 2002