Development of Cu–Sn intermetallic compound at Pb-free...

Development of Cu–Sn intermetallic compound at Pb-free solder/Cu joint interface

Xin Ma, Fengjiang Wang, Yiyu Qian, Fusahito Yoshida
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Volume:
57
Year:
2003
Language:
english
DOI:
10.1016/s0167-577x(03)00075-2
File:
PDF, 347 KB
english, 2003
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