Direct Measurement of Cure-Induced Stress in Thermosetting...

Macromolecular Rapid Communications 2006 Vol. 27; Iss. 16

Direct Measurement of Cure-Induced Stress in Thermosetting Materials by Means of a Dynamic Mechanical Analyzer

Hong Yu, Subodh G. Mhaisalkar, Ee Hua Wong
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Volume:
27
Year:
2006
Language:
english
Pages:
5
DOI:
10.1002/marc.200600215
File:
PDF, 250 KB
english, 2006
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