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Influence of interfacial reaction between molten SnAgCu solder droplet and Au/Ni/Cu pad on IMC evolution
Fu-quan LI, Chun-qing WANGVolume:
16
Year:
2006
Language:
english
DOI:
10.1016/s1003-6326(06)60004-6
File:
PDF, 1.03 MB
english, 2006