Effects of cooling rates on microstructure and...

Transactions of Nonferrous Metals Society of China 2006 Vol. 16; Iss. 1

Effects of cooling rates on microstructure and microhardness of lead-free Sn-3.5% Ag solders

Jun SHEN, Yong-chang LIU, Ya-jing HAN, Hou-xiu GAO, Chen WEI, Yu-qin YANG
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Volume:
16
Year:
2006
Language:
english
DOI:
10.1016/s1003-6326(06)60011-3
File:
PDF, 1.37 MB
english, 2006
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