Simulation on temperature field of TIG welding of copper without preheating
Yu-cheng LEI, Wen-xia YU, Cai-hui LI, Xiao-nong CHENGVolume:
16
Year:
2006
Language:
english
DOI:
10.1016/s1003-6326(06)60336-1
File:
PDF, 493 KB
english, 2006