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Characterization of flexible copper laminates fabricated by Cu electro-plating process
Chang-Min LEE, Jun-Hyung LIM, Soo-Min HWANG, Eui-Cheol PARK, Jong-Hyun SHIM, Jin-Hyun PARK, Jinho JOO, Seung-Boo JUNGVolume:
19
Year:
2009
Language:
english
DOI:
10.1016/s1003-6326(08)60387-8
File:
PDF, 344 KB
english, 2009