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Influences of diffusion bonding process parameters on bond characteristics of Mg-Cu dissimilar joints
G. MAHENDRAN, V. BALASUBRAMANIAN, T. SENTHILVELANVolume:
20
Year:
2010
Language:
english
DOI:
10.1016/s1003-6326(09)60248-x
File:
PDF, 799 KB
english, 2010