Numerical simulation on thixoforging of electronic...

Transactions of Nonferrous Metals Society of China 2010 Vol. 20; Iss. 9

Numerical simulation on thixoforging of electronic packaging shell with SiCp/A356 composites

Kai-kun WANG, Fu-yu WANG, Xue-jun CHEN, Lu WANG, Chun-mei MA
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Volume:
20
Year:
2010
Language:
english
DOI:
10.1016/s1003-6326(09)60362-9
File:
PDF, 618 KB
english, 2010
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