Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate
Qiulian Zeng, Jianjun Guo, Xiaolong Gu, Xinbing Zhao, Xiaogang LiuVolume:
26
Year:
2010
Language:
english
DOI:
10.1016/s1005-0302(10)60026-6
File:
PDF, 791 KB
english, 2010