Analysis and modeling of microstrip-to-coplanar flip chip...

International Journal of RF and Microwave Computer-Aided Engineering 2001 Vol. 11; Iss. 4

Analysis and modeling of microstrip-to-coplanar flip chip package interconnects

Hussein H. M. Ghouz, El-Badawy El-Sharawy
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
11
Year:
2001
Language:
english
Pages:
10
DOI:
10.1002/mmce.1025
File:
PDF, 212 KB
english, 2001
Conversion to is in progress
Conversion to is failed