![](/img/cover-not-exists.png)
Electrical modeling of packaging discontinuities: A general methodology based on the three-dimensional TLM concept
Chokri Boussetta, Fabien Ndagijimana, Jean Chilo, Pierre SaguetVolume:
5
Year:
1995
Language:
english
Pages:
11
DOI:
10.1002/mmce.4570050207
File:
PDF, 887 KB
english, 1995