Electrical modeling of packaging discontinuities: A general...

Electrical modeling of packaging discontinuities: A general methodology based on the three-dimensional TLM concept

Chokri Boussetta, Fabien Ndagijimana, Jean Chilo, Pierre Saguet
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Volume:
5
Year:
1995
Language:
english
Pages:
11
DOI:
10.1002/mmce.4570050207
File:
PDF, 887 KB
english, 1995
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