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Microprocessor system applications and challenges for...

Microprocessor system applications and challenges for through-silicon-via-based three-dimensional integration

Karnik, T., Somasekhar, D., Borkar, S.
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Volume:
5
Year:
2011
Language:
english
DOI:
10.1049/iet-cdt.2009.0126
File:
PDF, 740 KB
english, 2011
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