A three-layer 3D silicon system using through-Si vertical...

A three-layer 3D silicon system using through-Si vertical optical interconnections and Si CMOS hybrid building blocks

Bond, S.W., Vendier, O., Lee, M., Jung, S., Vrazel, M., Lopez-Lagunas, A., Chai, S., Dagnall, G., Brooke, M., Jokerst, N.M., Wills, D.S., Brown, A.

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Volume:

Year:

1999

Language:

english

DOI:

10.1109/2944.778306

File:

PDF, 671 KB

english, 1999

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