Multichip packaging technology with laser-patterned interconnects
Barfknecht, A.T., Tuckerman, D.B., Kaschmitter, J.L., McWilliams, B.M.Volume:
12
Year:
1989
Language:
english
DOI:
10.1109/33.49028
File:
PDF, 520 KB
english, 1989