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A 1 Tb/s 3 W Inductive-Coupling Transceiver for 3D-Stacked Inter-Chip Clock and Data Link
Miura, N., Mizoguchi, D., Inoue, M., Niitsu, K., Nakagawa, Y., Tago, M., Fukaishi, M., Sakurai, T., Kuroda, T.Volume:
42
Year:
2007
Language:
english
DOI:
10.1109/jssc.2006.886554
File:
PDF, 3.30 MB
english, 2007