A Flip-Chip-Packaged 25.3 dBm Class-D Outphasing Power...

IEEE Journal of Solid-State Circuits 2011 Vol. 46; Iss. 7

A Flip-Chip-Packaged 25.3 dBm Class-D Outphasing Power Amplifier in 32 nm CMOS for WLAN Application

Hongtao Xu, Palaskas, Y., Ravi, A., Sajadieh, M., El-Tanani, M.A., Soumyanath, K.
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Volume:
46
Year:
2011
Language:
english
DOI:
10.1109/jssc.2011.2143930
File:
PDF, 2.46 MB
english, 2011
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