Placement of thermal vias in 3-D ICs using various thermal...

Placement of thermal vias in 3-D ICs using various thermal objectives

Goplen, B., Sapatnekar, S.S.
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Volume:
25
Year:
2006
Language:
english
DOI:
10.1109/tcad.2006.870069
File:
PDF, 990 KB
english, 2006
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