Substrate Topological Routing for High-Density Packages

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 2009 Vol. 28; Iss. 2

Substrate Topological Routing for High-Density Packages

Shenghua Liu, Guoqiang Chen, Tom Tong Jing, Lei He, Tianpei Zhang, Dutta, R., Xian-Long Hong
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Volume:
28
Year:
2009
Language:
english
DOI:
10.1109/tcad.2008.2009154
File:
PDF, 1.18 MB
english, 2009
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