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Study on the Effect of Wafer Back Grinding Process on Nanomechanical Behavior of Multilayered Low-k Stack
Sekhar, V.N., Lu Shen, Kumar, A., Tai Chong Chai, Xiaowu Zhang, Premchandran, C.S., Kripesh, V., Seung Wook Yoon, Lau, J.H.Volume:
2
Year:
2012
Language:
english
DOI:
10.1109/tcpmt.2011.2141989
File:
PDF, 3.46 MB
english, 2012