Study on the Effect of Wafer Back Grinding Process on...

Study on the Effect of Wafer Back Grinding Process on Nanomechanical Behavior of Multilayered Low-k Stack

Sekhar, V.N., Lu Shen, Kumar, A., Tai Chong Chai, Xiaowu Zhang, Premchandran, C.S., Kripesh, V., Seung Wook Yoon, Lau, J.H.

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Volume:

Year:

2012

Language:

english

DOI:

10.1109/tcpmt.2011.2141989

File:

PDF, 3.46 MB

english, 2012

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