Novel Chip-Last Method for Embedded Actives in Organic...

IEEE Transactions on Components Packaging and Manufacturing Technology 2012 Vol. 2; Iss. 1

Novel Chip-Last Method for Embedded Actives in Organic Packaging Substrates

Baik-Woo Lee, Sundaram, V., Kennedy, S., Baars, D., Tummala, R.
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Volume:
2
Year:
2012
Language:
english
DOI:
10.1109/tcpmt.2011.2167013
File:
PDF, 1.60 MB
english, 2012
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