Moving Boundary Simulation and Experimental Verification of High Aspect-Ratio Through-Silicon-Vias for 3-D Integration
Chongshen Song, Zheyao Wang, Zhimin Tan, Litian LiuVolume:
2
Year:
2012
Language:
english
DOI:
10.1109/tcpmt.2011.2167681
File:
PDF, 975 KB
english, 2012