FSI Simulation of Wire Sweep PBGA Encapsulation Process...

FSI Simulation of Wire Sweep PBGA Encapsulation Process Considering Rheology Effect

Ramdan, D., Abdullah, Z.M., Mujeebu, M.A., Wei Keat Loh, Chun Keang Ooi, Renn Chan Ooi
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Volume:
2
Year:
2012
Language:
english
DOI:
10.1109/tcpmt.2011.2171513
File:
PDF, 1.40 MB
english, 2012
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