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FSI Simulation of Wire Sweep PBGA Encapsulation Process Considering Rheology Effect
Ramdan, D., Abdullah, Z.M., Mujeebu, M.A., Wei Keat Loh, Chun Keang Ooi, Renn Chan OoiVolume:
2
Year:
2012
Language:
english
DOI:
10.1109/tcpmt.2011.2171513
File:
PDF, 1.40 MB
english, 2012