Characterization of Encapsulants for High-Voltage...

IEEE Transactions on Components Packaging and Manufacturing Technology 2012 Vol. 2; Iss. 4

Characterization of Encapsulants for High-Voltage High-Temperature Power Electronic Packaging

Yiying Yao, Zheng Chen, Guo-Quan Lu, Boroyevich, D., Ngo, K.D.T.
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Volume:
2
Year:
2012
Language:
english
DOI:
10.1109/tcpmt.2011.2173344
File:
PDF, 1000 KB
english, 2012
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