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Fluid/Structure Interaction Analysis of the Effects of Solder Bump Shapes and Input/Output Counts on Moulded Packaging
Chu Yee Khor, Abdullah, M.Z., Wei Chiat LeongVolume:
2
Year:
2012
Language:
english
DOI:
10.1109/tcpmt.2011.2174237
File:
PDF, 1.48 MB
english, 2012