Laser-Enabled Advanced Packaging of Ultrathin Bare Dice in...

Laser-Enabled Advanced Packaging of Ultrathin Bare Dice in Flexible Substrates

Marinov, V., Swenson, O., Miller, R., Sarwar, F., Atanasov, Y., Semler, M., Datta, S.
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Volume:
2
Year:
2012
Language:
english
DOI:
10.1109/tcpmt.2011.2176941
File:
PDF, 886 KB
english, 2012
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