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Encapsulation of Microelectronic Components Using Open-Ended Microwave Oven
Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T., Adamietz, R., Muller, G., Eicher, F., Bailey, C.Volume:
2
Year:
2012
Language:
english
DOI:
10.1109/tcpmt.2011.2177524
File:
PDF, 660 KB
english, 2012