Effects of Slurry in Cu Chemical Mechanical Polishing (CMP)...

IEEE Transactions on Components Packaging and Manufacturing Technology 2012 Vol. 2; Iss. 6

Effects of Slurry in Cu Chemical Mechanical Polishing (CMP) of TSVs for 3-D IC Integration

Jui-Chin Chen, Lau, J.H., Pei-Jer Tzeng, Shang-Chun Chen, Chien-Ying Wu, Chien Chou Chen, Yu Chen Hsin, Yi-Feng Hsu, Shang Hung Shen, Sue-Chen Liao, Chi-Hon Ho, Cha-Hsin Lin, Tzu-Kun Ku, Ming-Jer Kao
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Volume:
2
Year:
2012
Language:
english
DOI:
10.1109/tcpmt.2011.2177663
File:
PDF, 1.76 MB
english, 2012
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