Impact of Packaging Design on Reliability of Large Die...

IEEE Transactions on Components Packaging and Manufacturing Technology 2012 Vol. 2; Iss. 5

Impact of Packaging Design on Reliability of Large Die Cu/Low- (BD) Interconnect

Chai, T.C., Zhang, X., Li, H.Y., Sekhar, V.N., Khan, O.K.N., Lau, J., Murthy, R., Yeow Meng Tan, Cheng, C.K., Siao Li Liew, Dongzhi Chi
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Volume:
2
Year:
2012
Language:
english
DOI:
10.1109/tcpmt.2011.2182351
File:
PDF, 1.54 MB
english, 2012
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