Multiscale, Multiphysics Model of Underfill Flow for...

Multiscale, Multiphysics Model of Underfill Flow for Flip-Chip Packages

Siyi Zhou, Ying Sun
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Volume:
2
Year:
2012
Language:
english
DOI:
10.1109/tcpmt.2012.2184762
File:
PDF, 1.40 MB
english, 2012
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