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High-Conductivity Adhesive for Light-Emitting Diode Die-Attachment by Low-Temperature Sintering of Micrometer-Sized Ag Particles
Kunimune, T., Kuramoto, M., Ogawa, S., Niwa, M., Nogi, M., Suganuma, K.Volume:
2
Year:
2012
Language:
english
DOI:
10.1109/tcpmt.2012.2188292
File:
PDF, 2.51 MB
english, 2012