Study on the Reliability of Application-Specific LED...

IEEE Transactions on Components Packaging and Manufacturing Technology 2012 Vol. 2; Iss. 7

Study on the Reliability of Application-Specific LED Package by Thermal Shock Testing, Failure Analysis, and Fluid–Solid Coupling Thermo-Mechanical Simulation

Zhaohui Chen, Qin Zhang, Feng Jiao, Run Chen, Kai Wang, Mingxiang Chen, Sheng Liu
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Volume:
2
Year:
2012
Language:
english
DOI:
10.1109/tcpmt.2012.2190934
File:
PDF, 1.00 MB
english, 2012
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