Thermal and Mechanical Considerations for Silicon-Resin...

IEEE Transactions on Components Packaging and Manufacturing Technology 2012 Vol. 2; Iss. 7

Thermal and Mechanical Considerations for Silicon-Resin High-Density Substrate

Smith, B., Kwok, P., Thompson, J., Mueller, A., Racz, L.
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Volume:
2
Year:
2012
Language:
english
DOI:
10.1109/tcpmt.2012.2198645
File:
PDF, 1.57 MB
english, 2012
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