Coupled Power and Thermal Cycling Reliability of...

IEEE Transactions on Electronics Packaging Manufacturing 2009 Vol. 32; Iss. 1

Coupled Power and Thermal Cycling Reliability of Board-Level Package-on-Package Stacking Assembly

Tong Hong Wang, Yi-Shao Lai, Chang-Chi Lee, Yu-Cheng Lin
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Volume:
32
Year:
2009
Language:
english
DOI:
10.1109/tepm.2008.2005300
File:
PDF, 1.54 MB
english, 2009
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